Term used to describe a microprocessor once the semiconductor die or dies have been encapsulated in a protective case with pin-outs, i.e., electronic connections which can be in various forms such as pin-gate-arrays (PGA), Ball Gate Arrays (BGA), Land Gate Arrays (LGA), etc. A package is what the broad public perceives to be a microchip or semiconductor chip. A package can contain multiple interconnected dies (chips) and is then known as a Multi-Chip-Package or MCP.